Modular power delivery networks for UAVs
The key challenge we see facing engineers today is the demand for smaller, lighter-weight designs that deliver higher power
Factorized power current multiplier
The VTM is a family of fixed ratio, isolated or non-isolated DC-DC transformer modules — also referred to as Point-of-Load (PoL) current multipliers. VTMs operate from a regulated primary bus to deliver a wide range of isolated outputs. A proprietary multi-megahertz ZCS/ZVS Sine Amplitude Converter™ (SAC™) topology transforms input voltages down to fractional voltages very efficiently for applications with demanding load and high-density requirements.
Features and Benefits
Features and benefits
High density
Wide VIN optimized for 48VOUT
High efficiency
Flexible
Select a VTM
0 Products
| Vin (V) | Vout (V) | Output Current (A) | Package | Add to cart / view details | ||
|---|---|---|---|---|---|---|
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.17 - 4.58) | Output Current (A): 50 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 6.0 (3.25 - 6.87) | Output Current (A): 40 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 8.0 (4.34 - 9.16) | Output Current (A): 30 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 9.6 (6.4 - 11.0) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 16 (8.67 - 18.3) | Output Current (A): 15 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 24 (13.8 - 26.5) | Output Current (A): 12 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 32 (17.3 - 36.7) | Output Current (A): 9 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 48 (26 - 55) | Output Current (A): 6 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 10 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.17 - 4.58) | Output Current (A): 25 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 4.0 (2.2 - 4.6) | Output Current (A): 50 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (0 - 60) | Vout (V): 12 (0 - 15) | Output Current (A): 12.5 | Package: 2308 SM-Chip | View details | |
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Vin (V): 48 (0 - 60) | Vout (V): 6 (0 - 7.5) | Output Current (A): 25 | Package: 2308 SM-Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 6.0 (2.85 - 6.88) | Output Current (A): 20 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 1.2 (0.7-1.4) | Output Current (A): 130 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 9.6 (5.2 - 11.0) | Output Current (A): 25 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 9.6 (5.2 - 11.0) | Output Current (A): 27 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 16 (8.7 - 18.3) | Output Current (A): 15 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 24 (13.0 - 27.5) | Output Current (A): 12.5 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 32 (17.3 - 36.7) | Output Current (A): 9.4 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 48 (26 - 55) | Output Current (A): 6.3 | Package: Full Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 6.0 (3.3 - 6.9) | Output Current (A): 20 | Package: Half Chip | View details | |
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Vin (V): 48 (26 - 55) | Vout (V): 12 (6.5 - 13.8) | Output Current (A): 12 | Package: Half Chip | View details | |
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Output
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Minimum output:
Nom output:
Nominal output:
Max output:
Maximum output:
Resources
Resources for the design engineer
High efficiency converters help maximize run-time for autonomous warehouse robots
High efficiency converters help maximize run-time
Attributes of high‑performance power module packaging
Power module packaging, has been a unique differentiator for Vicor since its inception
Delivering high current at very low voltage for satellite antennas
Delivering high current at very low voltage suits the need for a small, robust and reliable low profile power solution for antennas
- AN:005 – FPA Printed Circuit Board Layout Guidelines
- AN:009 – SMT J-Lead VI Chip Soldering Recommendations
- AN:017 – RoHS Compliant Through-Hole VI Chip Soldering Recommendations
- AN:031 – Through-Hole ChiP Package Soldering Guidelines
- AN:034 – Creating Higher Voltage Outputs using Series Connected Sine Amplitude Converters
- AN:036 – Recommendations for Maximum Compressive Force of Heat Sinks
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 60950-1, CSA 60950-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
- cURus – UL 62368-1, CSA 62368-1
- cTÜVus – EN 60950-1, UL 60950-1, CSA 60950-1
- CE Mark – Low Voltage Directive (2014/35/EU) and RoHS Recast Directive (2011/65/EU)
- CB Certificate – IEC 60950-1
For California residents see information regarding California Proposition 65
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